Suitable scenarios for liquid coating and solid coating

There are significant differences between liquid encapsulation and solid encapsulation in terms of material properties, production processes, and application scenarios.

Liquid Coating:

Material properties: Liquid silicone rubber (LSR) has good elastic recovery capability and can perform well at -50 ℃ to 200 ℃ It maintains elasticity within a certain temperature range, has good resistance to ultraviolet rays, ozone, and humidity changes, and also possesses excellent electrical insulation properties.
Production process: The LSR injection system can achieve automatic metering, mixing, and injection, reducing manual operation steps and helping to maintain production consistency. Its low viscosity characteristic allows it to fill complex mold structures, including fine gaps and thin-walled areas, with high molding precision and a relatively high material utilization rate.
Application scenarios: Liquid encapsulation is widely used in applications that require precise sealing, complex structures, or stable performance, such as electronic connectors, automotive components, consumer electronic products (especially wearable devices), and medical equipment manufacturing.

Solid rubber coating:

Material properties: Solid silicone typically requires more manual operations, including cutting, weighing, and arranging materials, and may face certain limitations when filling fine structures.
Production process: Solid silicone is typically produced using a molding process, with a relatively low level of automation and a relatively low material utilization rate. A certain proportion of vulcanized waste is generated in each production cycle.
Application scenarios: Solid-state encapsulation may be more suitable for scenarios that do not require high sealing performance or complex structures, or in situations where the level of production automation and material utilization requirements are not high.

Liquid encapsulation has clear advantages in applications that require high precision, complex structures, and stable performance, while solid encapsulation may be more suitable for scenarios where these requirements are not as stringent.