Disadvantages of Liquid Coating Process

The liquid encapsulation process, such as the process of encapsulating PC or metal parts with liquid silicone (LSR), although it has many advantages, also has some disadvantages and challenges.

1. Poor adhesion or delamination: Contamination of the PC surface, insufficient surface energy, poor material compatibility, and improper injection molding processes can all lead to poor adhesion or delamination.

2. Surface defects: Surface defects such as bubbles and impurities may be caused by poor exhaust, contamination of the rubber material, or uneven mixing.

3. Dimensional deviation or deformation: Low temperature, uneven stress, or unreasonable product structure of embedded objects may lead to dimensional deviation or deformation.

4. Incomplete curing: Insufficient vulcanization temperature, insufficient vulcanization time, or too low a temperature of the rubber compound can all affect the curing effect.

5. Color variation or spots: Uneven mixing of color paste, contamination of the rubber material or mold may lead to inconsistent colors.

6. Difficult demolding or product damage: Improper use of release agents or unreasonable mold design may lead to difficult demolding or product damage.

7. Low production efficiency: Excessive vulcanization time and unstable processes may reduce production efficiency.

8. Excess glue issue: Improper mold design, excessive injection pressure, inaccurate temperature control, insufficient mold clamping force, material problems, unreasonable process parameter settings, or equipment issues can all lead to excess glue.